| 摘要 |
PROBLEM TO BE SOLVED: To radiate heat efficiently without applying excessive stress to an electronic component. SOLUTION: Heat of the electronic component 4 mounted on a printed circuit board 3 is transferred to the wall face of a chassis 2 sequentially via heat transfer blocks 5, 6 made of extrusion-molded aluminum to be radiated. On the lower face side of a first heat transfer block 5 which is brazed to the electronic component 4, a plurality of concave grooves 5a and convex ridges 5b extending backward and forward are formed alternately in an equal width (like a comb). On the upper face side of a second transfer block 6 which is brazed to the inner bottom face of the chassis 2, convex ridges 6b and concave grooves 6a extending backward and forward are formed to fit in the concave grooves 5a and the convex ridges 5b. Making the concave grooves 5a, 6a of the heat transfer blocks 5, 6 fit in the concave grooves 6b, 5b, their wall faces come into contact with each other, and bring them together thermally. Silicon grease is applied to their contact faces. COPYRIGHT: (C)2004,JPO&NCIPI
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