SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF WITH SURFACE MOUNTED LEADLESS STRUCTURE

摘要

PURPOSE: A semiconductor device is provided to plan a completely thin-film semiconductor device in a leadless structure having no leadframe and to improve adhesion intensity of a conductive part and sealing resin. CONSTITUTION: A semiconductor device(10) is prepared. A plurality of conductive parts(20) are connected to the semiconductor device by wire(30). The semiconductor device, the wire and the conductive parts are sealed by sealing resin(40). The conductive part includes a small diameter part(20b) and a lengthily protruding part(20a) protruding from the small diameter part.