| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing equipment which can satisfactorily clean a periphery part of a substrate. SOLUTION: First cleaning-liquid feeding nozzles 7, 8, for feeding selectively a chemical liquid and pure water to a wafer W, are respectively located around a center of cleaning brushes 66, 86 which are positioned above and below the wafer W. In a periphery part cleaning box 300 for cleaning selectively the periphery part of the wafer W, a second cleaning-liquid feeding nozzle, which feeds an etching liquid to remove slurry from the periphery part of the wafer and to etch an unnecessary thin film around the periphery part, is located around the periphery part of upper/lower surfaces of the wafer W. COPYRIGHT: (C)2004,JPO&NCIPI |
