发明名称 Magnetoresistive (MR) sensor element with sunken lead structure
摘要 A method for forming a magnetoresistive (MR) sensor element. There is first provided a substrate. There is then formed over the substrate a seed layer. There is then formed contacting a pair of opposite ends of the seed layer a pair of patterned conductor lead layer structures. There is then etched, while employing an ion etch method, the seed layer and the pair of patterned conductor lead layer structures to form an ion etched seed layer and a pair of ion etched patterned conductor lead layer structures. Finally, there is then formed upon the ion etched seed layer and the pair of ion etched patterned conductor lead layers structures a magnetoresistive (MR) layered structure. Within the magnetoresistive (MR) sensor element, the pair of patterned conductor lead layer structures may be formed within a pair of recesses within an ion etch recessed dielectric isolation layer.
申请公布号 US6798622(B2) 申请公布日期 2004.09.28
申请号 US20030370346 申请日期 2003.02.19
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 JU KOCHAN;CHANG JEI-WEI;HORNG CHENG
分类号 G01R33/09;G11B5/31;G11B5/39;H01L21/8246;H01L27/22;(IPC1-7):G11B5/127 主分类号 G01R33/09
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