| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board for high density mounting having the small land diameter of an outer layer in the multilayer printed circuit board used for a variety of electronic devices. SOLUTION: A film-like insulating resin 4 and a metal foil 5 are laminated on a conductor pattern 2 for an inner layer and an insulating board 3 for the inner layer having a conduction hole filled up with conductive paste, heated and pressurized to cure the resin. After an interstitial via hole is provided by laser working, an IVH 8 for electrically connecting the inner and outer layers by metal plating, etc. is formed, a conductor pattern 9 for the outer layer is thereafter formed on the metal of the surface, and the multilayer printed circuit board 10 for the high density mounting is manufactured. COPYRIGHT: (C)2005,JPO&NCIPI |
