Fabricating preassembled optoelectronic interconnect structures

摘要

Fabricating preassembled optoelectronic interconnect structures is provided, which have an optical waveguide link with first and second optoelectronic circuits attached to first and second ends of the waveguide link. The optoelectronic circuits include active optical componentry which facilitates optical signal communication across the optical waveguide link. Further, first and second pluralities of electrical contacts are associated with the first and second optoelectronic circuits, respectively, to facilitate electrically, operatively connecting the interconnect structure between first and second components of an electronic assembly as, for instance, a single, field-replaceable unit. The first and second components of the electronic assembly may be, for instance, stacked electronic components of the electronic assembly, or laterally offset components of a substantially planar electronic assembly.

主权项

1. A method comprising:
preassembling an interconnect component comprising an optoelectronic interconnect structure, the preassembling comprising:
electrically connecting a first optoelectronic circuit to a first end of an optical waveguide link with a first plurality of electrical contacts associated with the first optoelectronic circuit, andelectrically connecting a second optoelectronic circuit to a second end of the optical waveguide link, with a second plurality of electrical contacts associated with the second optoelectronic circuit, the first and second optoelectronic circuits comprising active optical componentry for optical signal communication across the optical waveguide link; and electrically connecting the interconnect component structure to a system, wherein the electrically connecting comprises orienting the interconnect component structure between a first integrated circuit chip and a second integrated circuit chip, of a plurality of circuit chips arranged in a stack and extending, at least in part, vertically along the edge of the stack between the first integrated circuit chip and the second integrated circuit chip, the system comprising:
the plurality of integrated circuit chips;a plurality of vertical electrical interconnects electrically connecting together the plurality of integrated circuit chips arranged in the stack, the plurality of vertical electrical interconnects extending, at least in part, through the plurality of integrated circuit chips in the stack; andthe interconnect component structure.