发明名称 Ceramic package, electronic component device, and method for manufacturing the electronic component device
摘要 A ceramic package includes a package body made of a ceramic and including a pair of surfaces, and side surfaces, disposed between four sides of one of the surfaces and four sides of the other surface; a cavity that has an opening in the surface of the package body; a metalizing layer disposed over the surface of the package body surrounding the opening of the cavity; and a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween. The surface surrounding the opening of the cavity includes pairs of opposing side portions and each side portion of at least one of the pairs has a recessed portion in a middle portion of the side portion and a pair of flat portions on respective sides of the recessed portion.
申请公布号 US9490772(B2) 申请公布日期 2016.11.08
申请号 US201615060747 申请日期 2016.03.04
申请人 NGK SPARK PLUG CO., LTD. 发明人 Hasegawa Masami
分类号 H01L23/10;H03H9/05;H05K1/03;H05K1/02;H05K3/10;H03B5/32 主分类号 H01L23/10
代理机构 Stites & Harbison, PLLC 代理人 Stites & Harbison, PLLC ;Haeberlin Jeffrey A.;Hayne James R.
主权项 1. A ceramic package comprising: a package body made of a ceramic and including a top surface and a bottom surface, each having a rectangular outline when viewed in a plan, and side surfaces disposed between four edges of the top surface and four edges of the bottom surface, the package body defining a cavity that has an opening in at least one of the top surface and the bottom surface of the package body, the opening rectangular when viewed in a plan; a metalizing layer disposed over the at least one of the top surface and the bottom surface of the package body, the metalizing layer surrounding the opening of the cavity and having a rectangular frame shape when viewed in a plan; and a metal frame joined to an upper surface of the metalizing layer with a brazing filler metal layer interposed therebetween, wherein the at least one of the top surface and the bottom surface of the package body includes pairs of opposing side portions surrounding the opening of the cavity and for at least one of the pairs of opposing side portions, each side portion of the pair includes a recessed portion in a middle portion of the side portion and a flat portion at each end of the recessed portion.
地址 Nagoya JP