| 摘要 |
PROBLEM TO BE SOLVED: To provide material for forming a high-conductivity wiring body having volume resistivity of 5×10<SP>-6</SP>Ωcm or below through a treatment carried out at comparatively low temperatures of 300°C or below, and also to provide the high-conductivity wiring body formed of the above material, and a method of manufacturing the same. SOLUTION: The wiring body forming material contains silver particles and a resin binder. The silver particles are 0.05 to 0.5μm in average grain diameter measured through a laser diffraction method, the mass ratio of the silver particles having grain diameters of 0.5μm or above to the whole is 30 mass% or below. Provided that a temperature at which the silver particles start fusing singly is represented by T1 measured through TMA and that another temperature at which the resin binder is reduced in weight by 5% through thermogravimetric analysis is represented by T2, T1 is set lower than T2. Provided that the percentage of void of the silver particles is represented by a value that is obtained by subtracting the quotient, which is obtained by dividing the tap density of the silver particles with the true density of silver, from 1, and when the mixture of the silver particles and the resin binder is finally made to serve as a wiring body, the compounding ratio of the resin binder to the mixture is set lower than the above percentage of void of the silver particles. COPYRIGHT: (C)2005,JPO&NCIPI
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