| 摘要 |
PROBLEM TO BE SOLVED: To restrain the transformation of a viahole and to form the viahole with a sufficient yield and utilize an improved effect of connection reliability between the viahole and a copper circuit by using nano paste, in a multilayer wiring board wherein the nano paste is used as a conductor of the viahole for interlayer conduction. SOLUTION: A strut component 26 which restrains the transformation of the nano paste 25 is formed in the viahole 24. Since conductive paste with which the viahole is filled up, conductive paste called the nano paste which contains filler metal whose mean particle diameter is 1-100 nm is used. It is preferable that the strut component has compressive strength-proof suitably. The strut component is constituted of an object wherein the conductive paste of a polymer type is cured which uses silver or copper or a copper particle whose surface is coated with silver as filler metal, or constituted of a metal body grown up by solder plating. COPYRIGHT: (C)2005,JPO&NCIPI |
