| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for bonding with which an initial shift and an internal stress of a bonding material due to curing shrinkage are reduced and a change with time (a shift with time) of the bonding material is reduced when parts are joined with an energy ray-curable adhesive. SOLUTION: An adhesive having energy ray-curing characteristics is partially irradiated with energy rays and the irradiated part is scanned to cure the whole adhesive layer. Curing is partially and successively carried out while maintaining a state in which an uncured part is present in the periphery of the irradiated part by curing the whole adhesive layer. The amount of curing and shrinking of the adhesive (a reduction in volume due to the curing shrinkage) is supplemented from the uncured adhesive having fluidity in the periphery of the irradiated part. Thereby, the production of stress (tensile stress) in the interior of the adhesive due to the curing shrinkage is suppressed. As a result, the initial shift of the bonding material due to the curing shrinkage of the adhesive is reduced and the positional shift (shift with time) of the bonding material caused by natural and gradual release of the residual stress in the adhesive layer is remarkably reduced. COPYRIGHT: (C)2006,JPO&NCIPI |
