ELECTRONIC DEVICE COMPRISING SECURE HEAT DISSIPATION

摘要

The aim of the invention is to obtain secure heat dissipation in an electronic device (1). Said aim is achieved by providing a multi-component housing (2) comprising a housing shell (3) and a housing lid (4). A support plate (26) that is fitted with at least one power electronics component (7) is disposed on a base plate (19) of the housing shell (3). The housing lid (4) supports a mounting device (11, 12) for fastening the housing (2) to a cooling body (13) by pressing the support plate (26) to a supporting area (27) of the cooling body (13). At least one supporting element (24, 25, 31, 32) is provided for transferring a pressing force (F) that is applied in the direction of the base plate (19) from the housing lid (4) to the housing shell (3).