| 摘要 |
PROBLEM TO BE SOLVED: To provide a moisture curing type hot melt adhesive scarcely causing yellowing and problem of molecular scission, etc., and having sufficient moisture curing rate and good heat stability. SOLUTION: The invention relates to the moisture curing type hot melt adhesive comprising a urethane prepolymer obtained by reacting a polyol compound having two or more hydroxy groups in a molecule and a polyisocyanate compound having two or more isocyanate groups in a molecule, wherein the adhesive uses a polyisocyanate compound having isocyanate groups directly bonded to an aromatic ring and contains a hindered amine based light stabilizer (HALS) in which the amine group is a tertiary amine. An organic phosphorus compound which is solid at normal temperature, is added to improve the thermal stability of the adhesive. COPYRIGHT: (C)2006,JPO&NCIPI
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