发明名称 |
METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming a capacitor of a semiconductor device. SOLUTION: This method comprises a step for forming a capacitor electrode by etching a metal nitride film under an environment containing fluorine and oxygen. The metal nitride film may be plasma-etched under an environment containing fluorine plasma. The fluorine may consist of at least one of CF<SB>4</SB>and CHF<SB>3</SB>. Further, the metal nitride film may comprise at least one out of titanium, tantalum and tungsten. The metal nitride film may be plasma-etched under an environment where a power of 600 W or less is supplied. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006060220(A) |
申请公布日期 |
2006.03.02 |
申请号 |
JP20050236153 |
申请日期 |
2005.08.16 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
CHO SEONG-IL;KIN SHOKEI;NAN HEIIN;CHI KYOKYU;LEE CHEOL-KYU |
分类号 |
H01L21/8242;H01L21/3065;H01L21/768;H01L21/8246;H01L27/105;H01L27/108 |
主分类号 |
H01L21/8242 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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