发明名称 METHOD FOR FORMING CAPACITOR OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a capacitor of a semiconductor device. SOLUTION: This method comprises a step for forming a capacitor electrode by etching a metal nitride film under an environment containing fluorine and oxygen. The metal nitride film may be plasma-etched under an environment containing fluorine plasma. The fluorine may consist of at least one of CF<SB>4</SB>and CHF<SB>3</SB>. Further, the metal nitride film may comprise at least one out of titanium, tantalum and tungsten. The metal nitride film may be plasma-etched under an environment where a power of 600 W or less is supplied. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006060220(A) 申请公布日期 2006.03.02
申请号 JP20050236153 申请日期 2005.08.16
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 CHO SEONG-IL;KIN SHOKEI;NAN HEIIN;CHI KYOKYU;LEE CHEOL-KYU
分类号 H01L21/8242;H01L21/3065;H01L21/768;H01L21/8246;H01L27/105;H01L27/108 主分类号 H01L21/8242
代理机构 代理人
主权项
地址