发明名称 METHOD FOR FORMING MULTILAYER STRUCTURE, METHOD FOR MANUFACTURING WIRING BOARD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
摘要 PROBLEM TO BE SOLVED: To make it possible to form a stable multilayer structure by using an ink jet method. SOLUTION: The method for forming a multilayer structure includes the steps that (A) a drop of a first insulating material containing a first photosensitive resin is discharged to the surface of an object from a first nozzle, and a first insulating material layer is formed to cover the surface thereof; (B) the first insulating material layer is cured to obtain the first insulating layer; (C) the drop of a conductive material is discharged to the first insulating layer from a second nozzle, and the pattern of a conductive material layer is formed on the first insulating layer; and (D) the pattern of the conductive material layer is activated to form a wiring pattern on the first insulating layer. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006093264(A) 申请公布日期 2006.04.06
申请号 JP20040274621 申请日期 2004.09.22
申请人 SEIKO EPSON CORP 发明人 NIIDATE TAKESHI;SAKURADA KAZUAKI;YAMADA JUN
分类号 H05K3/10;H05K3/46 主分类号 H05K3/10
代理机构 代理人
主权项
地址