发明名称 Optical finger navigation device
摘要 An optical finger navigation (OFN) device for use in handheld portable devices is presented. The OFN device may include a light source, a sensor, a lens holder integrated with a light guide system and a molded lead frame. The lens holder may include a lens receiving region for receiving the lens, a light guide system for directing light emitted by the light source towards the navigation surface. The light guide system may include a slanted wall that may be coated with a light reflective material.
申请公布号 US9619047(B2) 申请公布日期 2017.04.11
申请号 US201012912281 申请日期 2010.10.26
申请人 PIXART IMAGING INC. 发明人 Lum Chee Foo;Lee Sai Mun;Tee Khoon Guan;Lee Hun Kwang
分类号 G06F3/03 主分类号 G06F3/03
代理机构 Li & Cai Intellectual Property (USA) Office 代理人 Li & Cai Intellectual Property (USA) Office
主权项 1. An optical finger navigation device comprising: a light source configured to emit light; a sensor configured to receive light from a navigation surface; a molded lead frame comprising a base with a plurality of pins; a lens configured to direct light from the navigation surface toward the sensor; and a lens holder molded to form a unitary structure, the lens holder comprising: a lens receiving region configured to receive the lens;a light guide system for directing the emitted light towards the navigation surface in a light path that extends from the light source to the navigation surface; the light guide system comprising an aperture system that defines a cavity that passes through the lens holder; that is aligned with the light source; and that is configured to direct the emitted light from the light source towards the navigation surface in the light path; anda plurality of through holes, wherein the plurality of pins and the plurality of through holes mate together via a heat staking process, and wherein each of the plurality of pins passes through a corresponding through hole of the plurality of through holes and an end portion of the each of the plurality of pins is protruded from the corresponding through hole, and during the heat staking process the plurality of pins is heated and the end portion of each of the plurality of pins is deformed into a protrusion that has a diameter larger than a diameter of the plurality of pins such that the protrusion becomes a lock structure and the plurality of pins is locked within the plurality of through holes, respectively.
地址 Hsin-Chu TW