Pop structures and methods of forming the same

摘要

A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.

主权项

1. A method comprising:
bonding a discrete passive device to a package, wherein the package comprises:
a first molding material;a first device die molded in the first molding material, wherein the first device die comprises metal posts;a Through Assembly Via (TAV) penetrating through the first molding material; anda first redistribution line over the first molding material; and molding the discrete passive device in a second molding material, wherein the discrete passive device is bonded directly to the package, and an entirety of the discrete passive device is embedded in and surrounded by the second molding material.