SOLDER BATH FOR FLUX-FREE TINNING

摘要

A device for containing a heated bath of solder for coating or tinning an object without the use of flux by subjecting the bath and object to ultrasonic waves during the tinning process characterized by a probe or sonotrode of the ultrasonic transducer entering the bath through an aperture in the bottom wall of the container so that ultrasonic waves permeate the bath without wave interference due to reflecting from the walls of the container. The probe is sealed to the bottom wall by a device which includes a compressed ring-shaped seal member positioned to engage the probe at a nodal plane. Preferably the probe and transducer are interconnected by an intermediate member which is cooled either by fluids flowing through channels therein, or by a stream of air from a fan which stream is directed at the member so that the transducer does not become damaged by the heat conducted by the probe from the solder bath.