发明名称 |
Acoustic wave device and method of fabricating the same |
摘要 |
An acoustic wave device includes: a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate. |
申请公布号 |
US9473105(B2) |
申请公布日期 |
2016.10.18 |
申请号 |
US201314102363 |
申请日期 |
2013.12.10 |
申请人 |
TAIYO YUDEN CO., LTD. |
发明人 |
Kuroyanagi Takuma |
分类号 |
H01L41/047;H03H9/10 |
主分类号 |
H01L41/047 |
代理机构 |
Chen Yoshimura LLP |
代理人 |
Chen Yoshimura LLP |
主权项 |
1. An acoustic wave device comprising:
a substrate; a functional element formed on the substrate and including an excitation electrode that excites an acoustic wave; a columnar electrode formed on the substrate and electrically connected to the excitation electrode; a metal frame body formed on the substrate and surrounding the functional element and the columnar electrode in a plan view and electrically isolated from the columnar electrode; and a ceramic substrate sealing the functional element in combination with the metal frame body, a first metal layer bonded to the columnar electrode and a second metal layer bonded to the metal frame body being formed on a surface of the ceramic substrate, the first metal layer being located between the columnar electrode and the ceramic substrate, the second metal layer being located between the metal frame body and the ceramic substrate. |
地址 |
Tokyo JP |