Method and device for determining the pressure distribution for bonding

摘要

A method and a device for determining the pressure distribution for bonding of a first substrate to a second substrate, with the following steps, especially with the following sequence: placing a measurement layer between a first tool for holding the first substrate and an opposite second tool which is aligned to the first tool for bonding of the substrate, deformation of the measurement layer by bringing the tools closer to one another, measurement of the deformation of the measurement layer and computation of the pressure distribution.

主权项

1. A method for determining pressure distribution for bonding of a first substrate to a second substrate, the method comprising:
applying a measurement layer to any one of, the first substrate, the second substrate, and the first and second substrate, depositing the first substrate on a first tool for holding the first substrate, introducing the second substrate in a region between the first substrate and a second tool located opposite the first tool, the second tool aligned to the first tool for bonding of the first substrate to the second substrate, deforming the measurement layer to alter its shape by bringing the first and second tools closer to one another, measuring deformation of the measurement layer, and computing the pressure distribution based on the measurement of the deformation.