发明名称 Method of forming a laminate
摘要 A method of forming a laminate is disclosed. The method comprises placing a metal film in juxtaposition to a surface to be joined thereto. A buffer medium having an explosive charge on at least one surface thereof is positioned proximate the film. The explosive charge is detonated to propel the film against the surface to shear a portion of the film, corresponding in shape to the surface, away from the buffer medium to bond the sheared portion to the surface.
申请公布号 US3998374(A) 申请公布日期 1976.12.21
申请号 US19750596028 申请日期 1975.07.11
申请人 WESTERN ELECTRIC COMPANY, INC. 发明人 CRANSTON, BENJAMIN HOWELL;HORNIG, CARL FREDERICK;MACHUSAK, DONALD ARTHUR
分类号 H05K3/20;H05K1/11;H05K3/04;H05K3/22;H05K3/24;H05K3/32;H05K3/40;(IPC1-7):H05K3/24;B23K28/00 主分类号 H05K3/20
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