| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method which is suitable for preventing solder scattering occurring in solder-bonding, and suppressing generation of voids in solder in manufacturing a solder bonded body in which a first member and a second member are solder-bonded.SOLUTION: A workpiece W1 which is formed by interposing a solder paste 40 between a first member 10 and a second member 20 is prepared. A manufacturing method includes: a preheating process of heating the workpiece W1 at a first temperature T2 higher than a normal temperature; a main heating process of melting solder 30 by heating the workpiece W1 at a second temperature T3 higher than the first temperature T2; and a cooling process of cooling and solidifying the molten solder 30. The manufacturing method includes a viscosity adjusting process, before the preheating process, of maintaining the workpiece W1 at the third temperature T1 lower than the first temperature T2 so that an outer surface 40a side contacting with outside air becomes highly-viscous than an inner side of the solder paste 40.SELECTED DRAWING: Figure 3 |
