发明名称 |
PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES, PARTICULARLY FOR EXTREME TEMPERATURE APPLICATIONS |
摘要 |
A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10−6° C.−1, the support being made of a metal material having a coefficient of thermal expansion lower than 6×10−6° C.−1. |
申请公布号 |
US2016377656(A1) |
申请公布日期 |
2016.12.29 |
申请号 |
US201615257443 |
申请日期 |
2016.09.06 |
申请人 |
Technoprobe S.p.A. |
发明人 |
Liberini Riccardo;Vallauri Rafaele;Crippa Giuseppe |
分类号 |
G01R1/073 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
1. A probe card for a testing apparatus of electronic devices, comprising:
at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip adapted to abut onto a respective contact pad of a plurality of contact pads of a device under test, a support plate configured to support the testing head a stiffener associated with the support plate, an intermediate support, connected to the support plate and adapted to provide a spatial transformation of distances between contact pads on opposite faces of the intermediate support, and a support joined with the intermediate support, the intermediate support being made of a material compatible with technologies for printed circuits and having a thermal expansion coefficient greater than 10×10−6° C.−1 and the support being made of a metallic material having a thermal expansion coefficient smaller than 6×10−6° C.−1. |
地址 |
Cernusco Lombardone IT |