发明名称 Transistor with diamond gate
摘要 A field effect transistor having a diamond gate electrode and a process for forming the same. In some embodiments, the device is an AlGaN/GaN high-electron-mobility transistor (HEMT). The diamond gate electrode is formed so that it directly contacts the barrier layer. In some embodiments, the diamond gate electrode is formed from boron-doped nanocrystalline diamond (NCD), while in other embodiments, the diamond gate electrode is formed from single crystal diamond.
申请公布号 US9466684(B2) 申请公布日期 2016.10.11
申请号 US201615080624 申请日期 2016.03.25
申请人 The United States of America, as represented by the Secretary of the Navy 发明人 Koehler Andrew D.;Anderson Travis J.;Tadjer Marko J.;Hobart Karl D.;Feygelson Tatyana I.
分类号 H01L29/43;H01L29/47;H01L29/267;H01L29/66;H01L29/20;H01L29/778;H01L29/205;H01L29/10 主分类号 H01L29/43
代理机构 US Naval Research Laboratory 代理人 US Naval Research Laboratory ;Barritt Joslyn
主权项 1. A method for forming a semiconductor device having a diamond gate electrode, comprising: forming a semiconductor material buffer layer on a substrate, the semiconductor material buffer layer having a first bandgap and being configured to provide electron transport in the semiconductor device; forming a semiconductor barrier layer on an upper surface of the semiconductor material buffer layer, the semiconductor barrier layer having a second bandgap, the second bandgap being wider than the first bandgap; depositing an ohmic metal layer on an upper surface of the semiconductor barrier layer and patterning the ohmic metal layer to provide an opening for a doped diamond gate electrode; and forming the diamond gate electrode, the diamond gate electrode being formed from doped diamond material grown directly on the upper surface of the semiconductor barrier layer, the dopant in the doped diamond material being concentrated at a nucleation interface between the doped diamond material and the upper surface of the semiconductor barrier layer; wherein the diamond gate electrode is formed so that at least a portion of the diamond gate electrode is in direct contact with the upper surface of the semiconductor barrier layer.
地址 Washington DC US