| 摘要 |
PURPOSE:To improve grinding efficiency by determining the height of applying block for grinding siliconwafer in relation to the thickness of a support surrounding the block and thickness of the wafer to be ground. CONSTITUTION:A grinding block 5 to be attached to seleconwafer 1 on the undersurface thereof by using wax 2 is formed into cylindrical form having a brim on the upper side. Next, the block 5 is fitted into a hole disposed in a support 4 and exposed undersurface of the wafer 1 is oppositely contacted with grinding surface (not shown) and ground. In such constitution, the relations of the length L of the block 5 under the brim, the thickness l of the support 4, the thickness t of the wafer 1 to be ground and the grinding amount DELTAt, are represented as L=l-t+ DELTAt. Thus, individual difference of finishing thickness is avoided and grinding effect is improved. |
