| 摘要 |
PURPOSE:To simplify fixation while eliminating the need for extra parts, by mounting electronic parts on the elastic part of a lower frame body and then by pushing the parts against the conductive part of a circuit substrate. CONSTITUTION:Upper frame body 1, made of thermoplastic resin, has projection 1a at a position corresponding to the electrode of chip capacitor 4 and thin circuit substrate 2 is positioned which has conductive parts 2a and 2b at places corresponding to electrode 4a of capacitor 4. Lower frame body 3 formed by injection molding of insulating thermoplastic resin contains cubic capacitor 4 with electrode 4a formed by thin-film printing and has hole 36 provided with projection 3a at its thin and properly-elastic bottom part. For the purpose, capacitor 4 is inserted into hole 3b and frame bodies 1 and 3 are fixed sandwiching substrate 2, so that the capacitor, electronic parts, can easily be fitted and fixed. |
