| 摘要 |
PURPOSE:To enhance the moisture resistance, solvent resistance, wear resistance, etc. of a photosensitive resin composition by preparing the composition from polyamide contg. basic nitrogen, a specified monomer having a photopolymerizable unsatd. bond and a photopolymn. initiator. CONSTITUTION:A photosensitive resin composition is prepared from polyamide contg. basic nitrogen, all or part of a monomer having a photopolymerizable unsatd. bond and represented by formulaIand a photopolymn. initiator. The composition is formed into a sheetlike body having a desired thickness such as a sheet, a film or foil by hot pressing, casting, melt extrusion or other method. |
