| 摘要 |
PURPOSE:To improve reliability by preliminarily forming a metal coating having excellent oxidizing corrosion resistance on the lead part on which external metal coating is no longer coated because of the presence of a thin resin film, which is attached when the resin is sealed, thereby avoiding the oxidizing corrosion. CONSTITUTION:The noble metal coating 204 is formed on the part to which a bonding wire 206 is to be connected on a lead frame 200, and the oxidation resisting metal coating 210 such as Ni and Ag is formed on a boundary part which is sealed by the resin 207. After the semiconductor 205 is placed on the lead frame 200, sealing is performed by the resin 207. When the external metal coating is formed on externl leads 202, said metal coating is not formed on the boundary of the resin sealed part due to flash. Even through the flash is peeled off later, the part is not corroded owing to the presence of the oxidation resisting metal coating 210. |
