| 摘要 |
<p>PURPOSE:To obtain the package at low cost by a method wherein, when a programmable read-only memory storage which is installed on a lead frame is sealed, the package is formed using a plastic, it is divided into the upper and the lower parts, an ultraviolet ray transmitting window is provided on the upper part, and these parts are then formed in one body. CONSTITUTION:A semiconductor chip 1, consisting of a programmable read-only memory storage with a light-receiving section, is adhered to the semiconductor mounting part located in the center of the lead frame. Then, the package upper part 3 and the lower part 4, having a recessed section are formed on the surface opposing respectively by a molding mold using a thermoplastic resin such as polyphenylene sulphide or the like in order to seal the chip 1, and a cavity, wherein the chip will be placed when the upper part 3 and the lower part 4 are formed in one body, is formed. Also, an ultraviolet ray transmitting window 5 corresponding to the chip 1 is provided on the part 3, and a lid 6 consisting of a quartz or sapphire plate, which transmits ultraviolet rays is adhered in such a manner that it is covering the wondow 5.</p> |
