发明名称 SEMICONDUCTOR DEVICE MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method, especially a solar cell manufacturing method, which solves a problem of contamination in a semiconductor device by metal; or provide a dopant composition for screen printing, which solves a problem of contamination in a semiconductor device by metal.SOLUTION: A semiconductor device manufacturing method of the present embodiment comprises the step of screen-printing a dopant composition on a silicon layer or a base material, in which the dopant composition contains in a dispersion medium, at least (i) doped silicon particles or (ii) a dopant compound and non-doped silicon particles and performing the screen printing by using a non-metallic screen. A dopant composition for screen printing of the present embodiment contains in a dispersion medium, at least (i) doped silicon particles or (ii) a dopant compound and non-doped silicon particles and a content rate of a polymer component is equal to or less than 1.0 wt%.SELECTED DRAWING: None
申请公布号 JP2016189424(A) 申请公布日期 2016.11.04
申请号 JP20150069488 申请日期 2015.03.30
申请人 TEIJIN LTD 发明人 IKEDA YOSHINORI
分类号 H01L21/225;H01L31/18 主分类号 H01L21/225
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