发明名称 LEDのリードフレーム用銅合金板条
摘要 PROBLEM TO BE SOLVED: To increase the brightness of an LED package by improving the reflectance of an AG plating reflection film formed on the surface of a lead frame made of a Cu-Fe-based copper alloy strip.SOLUTION: There is provided a Cu-Fe-based copper alloy strip which comprises 0.01 to 0.5 mass% of Fe, 0.01 to 0.20 mass% of P, 0.01 to 1.0 mass% of Zn and 0.01 to 0.15 mass% of Sn and in which the remainder is substantially composed of Cu and inevitable impurities, wherein depressions, which have a surface roughness Ra of 0.2 μm or less, an Rzof 1.2 μm or less and an Rz of 1.5 μm or less in the rolling vertical direction and have an average length in the rolling parallel direction of 2 to 100 μm, an average length in the rolling vertical direction of 1 to 30 μm and a maximum depth along the rolling parallel direction of 400 nm or less, are densely formed on the surface. Ra represents an arithmetic average roughness, Rzrepresents a ten-point average roughness and Rz represents a maximum height roughness.
申请公布号 JP6026935(B2) 申请公布日期 2016.11.16
申请号 JP20130067467 申请日期 2013.03.27
申请人 株式会社神戸製鋼所 发明人 三輪 洋介;真砂 靖;西村 昌泰;松下 秀輝
分类号 C22C9/00;B21B3/00;C22C9/02;C22C9/04;H01B1/02;H01B5/02;H01L23/48 主分类号 C22C9/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利