| 摘要 |
PURPOSE:To reduce the chip side of a semiconductor integrated circuit by forming a pad which inputs to and outputs from an internal element with a bonding pad in a double structure. CONSTITUTION:An insulator 6 is covered to open a hole on the first pad 5 at the time of forming an insulator cover, the second pad is then deposited, and the insulator 6 is again covered. Thus, the pad is formed in a double structure, thereby designing the distance 7 between the pad 5 and the internal element 3 at the minimum. Accordingly, the integration can be enhanced. The area necessary for the bonding can be obtained with the pad 2'. |
