发明名称 COMPOSITE ELECTRONIC COMPONENT
摘要 A composite electronic component includes a first and second electronic elements, and a joint material. The first electronic element includes a base member, and an upper surface conductor on an upper surface of the base member. The second electronic element includes an element body with a lower surface facing the upper surface of the base member, and a terminal conductor disposed on the lower surface of the element body. The joint material joins the upper surface conductor and the terminal conductor. The upper surface conductor includes a conductive layer in which a metal that is maximum in weight ratio is Ag. The lateral surface of the conductive layer is covered with conductive layers defining a protective metal film, and the metal that is maximum in weight ratio contained in the conductive layers defining a protective metal film is a metal other than Ag and Cu.
申请公布号 US2016372265(A1) 申请公布日期 2016.12.22
申请号 US201615176564 申请日期 2016.06.08
申请人 Murata Manufacturing Co., Ltd. 发明人 HATTORI Kazuo;FUJIMOTO Isamu;KUROIWA Shinichiro
分类号 H01G4/30;H01F27/28;H01G4/12;H01G4/40;H01G4/248;H01G4/005 主分类号 H01G4/30
代理机构 代理人
主权项 1. A composite electronic component comprising: a first electronic element; a second electronic element mounted on the first electronic element in a height direction; and a joint material joining the first electronic element and the second electronic element; wherein the first electronic element includes an insulating base member including an upper surface intersecting with the height direction, and an upper surface conductor disposed on the upper surface of the base member; the second electronic element includes an element body including a lower surface facing the upper surface of the base member in the height direction, and a terminal conductor disposed on at least a portion of the lower surface of the element body; the joint material joins at least a portion of the upper surface conductor and at least a portion of the terminal conductor; the upper surface conductor includes a conductive layer containing Ag or Cu as a metal component that is maximum in weight ratio; at least a portion of the lateral surface of the conductive layer is covered with a protective metal film; the metal component that is maximum in weight ratio contained in the protective metal film is a metal other than Ag and Cu.
地址 Nagaokakyo-shi JP