METHOD AND APPARATUS FOR DEPOSITING MATERIAL

摘要

PROBLEM TO BE SOLVED: To provide a method for depositing a dielectric material on a substrate in a chamber by pulse DC magnetron sputtering and uniformly achieving the thickness of the deposited film.SOLUTION: A method for depositing a dielectric material on a substrate 26 in a chamber by pulse DC magnetron sputtering using a pulse DC magnetron device 24 for creating one or more primary magnetic fields comprises: sputtering a sputtering material from a target 22; separating the target 22 from the substrate 26 by a space of 2.5-10 cm; creating a secondary magnetic field 21 in the chamber; and expanding plasma created by the pulse DC magnetron device 24 toward one or more walls of the chamber by the secondary magnetic field 21.SELECTED DRAWING: Figure 4