MOUNTING PROCESS OF CHIP PART

摘要

PURPOSE:To augment the mounting density of a chip part by a method wherein an insulating base thicker than electrodes is located and fixed between electrodes of a substrate whereon wiring electrodes are print-circuited and a chip part is placed on the insulating base while symmetrizing the chip electrodes provided on both ends with the location of the wiring electrodes to permeate solder into the electrodes. CONSTITUTION:An insulating base 16 thicker than electrodes 12 is fixed between the electrodes 12 of a substrate 11 whereon the wiring electrodes 12 are print circuit-formed. Next a chip part 14 is placed on the base 16 while symmetrizing the chip part electrodes 15 with the location of the wiring electrodes 12. Later solder 13 is permeated into the gap between the electrodes 15 and 12 by solder dipping. Through these procedures, the mounting space may be minimized since the soldering 13 may suffice for the space below the electrodes 15 of the chip part 14.