| 摘要 |
<p>PURPOSE:To attain a connection with an excellent yield by interposing photosetting or thermosetting resin between a metal projection on an electrode pad of a semiconductor element and a wiring pattern of a wiring substrate and by setting it under pressure. CONSTITUTION:A film of Cr-Cu or the like is connected on an electrode pad 2 of a semiconductor element 1, electrolytic plating is applied thereto, and thereby a projection 3 of Au is made. Photosetting or thermosetting resin 7 is applied on a glass substrate 4 which has a wiring pattern 6 prepared by plating Cu with Cu. The projection 3 and the wiring pattern are matched in position with each other and made to contact 8 under pressure so as to expand the resin 7 and attain electric connection, and a light or a heat is applied thereto. Then the resin is set 7' and fixed with electric continuity maintained. By this construction, the electrode pad of the semiconductor element and an outside circuit can be connected simply with each other.</p> |
