APPARATUS FOR COOLING INTEGRATED CIRCUIT CHIPS

摘要

The invention is intended to cool integrated circuit packages carried on substrates. As is known, to achieve such cooling, the substrates are mounted to a cold plate via a compliant mat acting as interface. In the invention the mat comprises a paste film in contact with the cold plate, a metallic film in contact with the paste and a third film in contact with the metallic film. Both the paste and the third film are heat conductive and electrically insulative. The metallic film acts to spread the heat generated by the circuit packages more uniformly. To render the mat more compliant the metallic film is etched to remove portions leaving an array of contact pads in respective alignment with the circuit packages. The contact pads of the array may be interconnected by unetched branch portions of the metallic film to spread the heat flux.