PRINTED WIRING BOARD AND PRODUCTION METHOD FOR PRINTED WIRING BOARD

摘要

A printed wiring board (1) having a component mounted thereto using solder and having: a laminate (2) comprising a laminated structure having laminated therein a substrate material layer (5) and a conductor layer (6) patterned upon the surface of the substrate material layer; a coating layer (3) covering the non-soldered section of the surface of the laminate and having openings (16) formed therein that comprise an opening shape corresponding to prescribed information for the component; and symbol sections (17) filling the openings and indicating prescribed information for the component.