METHOD FOR PLATING INORGANIC POWDER BY ELECTROLESS PLATING

摘要

PURPOSE:To form a uniform metallic film having high adhesive on inorg. powder by combining epoxy resin as a surface treating agent which captures a noble metal with silver ions an noble metallic ions for surface activation. CONSTITUTION:A curing agent is added to epoxy resin as a surface treating agent which captures a noble metal so that the epoxy resin is applied by a proper amount, and the epoxy resin is applied to inorg. powder such as mica or alumina powder by immersion with a mixer. The powder is immersed in a soln. contg. silver ions as noble metallic ions such as a silver nitrate soln. with stirring to activate the surface of the powder. The powder is then immersed in an electroless plating bath for copper plating, nickel plating or the like to form a metallic film of copper, nickel or the like on the surface of the inorg. powder. By this method, satisfactory antistatic and electromagnetic- wave shielding properties can be provided to a polymer contg. electrically conductive inorg. powder as a filler.