| 发明名称 |
Methods of Laser Trace Post Processing and Depaneling of Assembled Printed Circuit |
| 摘要 |
A method for processing a PCBa panel to individualize the PCBa's on the PCBa panel and depanel the PCBa panel in substantially one step is described. The PCBa panel initially comprises a number of PCBa's having components and traces common to a number of different product SKUs. During processing, the PCBa panel is loaded into a machine containing a first and second laser. The first laser severs extra traces on each PCBa to individualize the PCBa's for specific SKUs and the second laser cuts the links between each PCBa, thereby depaneling the PCBa panel. |
| 申请公布号 |
US2016338204(A1) |
申请公布日期 |
2016.11.17 |
| 申请号 |
US201515112644 |
申请日期 |
2015.01.20 |
| 申请人 |
SMART WAVE TECHNOLOGIES CORP. |
发明人 |
McMullen Scott Arthur;Zosimadis Peter |
| 分类号 |
H05K3/00;B23K26/351;B23K26/38;H05K1/02 |
主分类号 |
H05K3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing an assembled printed circuit board (PCBa) panel comprising the steps of:
a) loading at least one PCBa panel containing a plurality of connected PCBa's into a processing device having a first and second laser, wherein each PCBa has a plurality of traces; b) severing at least one trace on each PCBa using the first laser to individualize the PCBa's; and c) depaneling the PCBa panel to separate the plurality of connected PCBa's using the second laser. |
| 地址 |
Toronto CA |
