发明名称 |
METHOD AND DEVICE FOR FILM FORMATION BY LOW-TEMPERATURE PLASMA |
摘要 |
PURPOSE:To form a good-quality and flat insulating insulating film by a low- temperature plasma by cutting projections on the surface of the film while controlling the velocity of the ion flow for irradiating a sample. CONSTITUTION:A bias potential from a variable power source 16 is applied to a grid electrode 15 of this plasma film forming device. When a film is formed on the surface of a sample 10 without applying a bias potential to the grid electrode 15, an insulating film 14 is formed on the surface of the sample. The sample 10 is irradiated with the ions in a plasma 6 drawn into a sample chamber 7 from a plasma generating chamber 3 and are accelerated under the condition that a bias voltage is applied to the grid electrode 15 while stopping the supply of a film forming material gas 8. The ions bump against the side planes of projections 14b of the insulating film 14 and the projections are cut off gradually as A B C D E... to form a nearly flat surface at a last stage.
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申请公布号 |
JPS62111435(A) |
申请公布日期 |
1987.05.22 |
申请号 |
JP19860156089 |
申请日期 |
1986.07.04 |
申请人 |
HITACHI LTD;HITACHI SERVICE ENG CO LTD |
发明人 |
SONOBE TADASHI;SUZUKI NOBORU;CHIBA ATSUSHI;SUZUKI KAZUO;ISHIGAKI YUKIO;NAKATANI MITSUO;WATANABE TAKESHI |
分类号 |
H01L21/205;C23C16/511;H01J37/32;H01L21/31 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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