| 摘要 |
PURPOSE:To obtain a semiconductor integrated circuit which can place many types on the same wafer and be automatically inspected by disposing a substrate identifying special circuit pattern on the basis of a predetermined rule on a substrate. CONSTITUTION:Four chip identifying special electrodes 4A-4D are arranged on the periphery of a chip in a semiconductor integrated circuit. Various types of chips 1 are formed according to its internal circuit pattern 2, and selectively connected to be shortcircuited according to wiring patterns 5, 6 made, for example, of two conducive materials of the electrodes 4A-4D in response to the type in manufacturing steps. To shortcircuit the two electrodes of the four electrodes, six ways of combinations can be provided, and six types can be distinctly displayed. Then, the type of the chips can be readily identified by contacting a probe with the electrodes 4A-4D by an LSI tester, for example, in a manufacturing apparatus at inspecting time to check the shortcircuiting or opening state. |
