| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for mounting an electronic component which reduces a stress occurring in a wiring board due to the heat from an electronic component, while ensuring good transmission characteristics of high frequency signals, and to provide an electronic device using the package for mounting an electronic component.SOLUTION: A package 1 for mounting an electronic component has such a structure that each one end 12a, exposed from one principal surface 11a of a base 11, of a pair of first signal terminals 12 provided in a pair of first through holes 11b formed in a base 11, and the signal line conductor 13d and the component connection conductor 13e of a wiring board 13, mounted on the substrate mounting surface 14a of a substrate mounting part 14, are bonded by a bonding material 15. In the pair of first signal terminals 12, the tip of each one end 12a abuts against the end face 13c of the wiring board 13 facing the base, the center axis L of each one end 12a is outward from the component mounting surface 13a of the wiring board 13, and in a direction perpendicular to the component mounting surface 13a, the one ends 12a are provided to hold the substrate mounting surface 14a of the substrate mounting part 14 therebetween.SELECTED DRAWING: Figure 1 |
