| 摘要 |
The invention provides a processing method of a stacked wafer; in the stacked wafer with a chip stacked on the wafer, when the chip is bonded on a side of a bonding sheet, the wafer can still be cut into chips; the method is characterized in that a fixing step before a cutting step is arranged as below: in an area corresponding to a periphery remained area, a fixing agent is arranged between the bonding sheet and a surface of the wafer, so the periphery remained area of the wafer can be fixed on the bonding sheet. |
