| 摘要 |
PURPOSE:To reduce a cost by providing wiring patterns on both side surfaces of a ceramic substrate, connecting TAB.ICs to the patterns, and sealing them with sealing caps. CONSTITUTION:Wiring patterns 2, 2 are provided on both side surfaces of a ceramic substrate 1, TAB.ICs 3, 4 are respectively connected to the patterns 2, 2, sealed with sealing caps 5, 6, a heat sink 7 is mounted on the upper surface of the substrate 1, and a plurality of connecting terminals 8 are formed on the lower surface. Accordingly, various circuits may be associated by the combination of the TAB.ICs 3, 4 mounted on both side surfaces of the substrate 1. Two sets of conventional ceramic substrates and heat sinks are correspondingly used by one set of the substrate 1 and the heat sink 7. Thus, a cost can be reduced. |
