| 摘要 |
Provided is a cutting apparatus (1) that cuts a workpiece (ZE) by laser light (CW, PW). The cutting apparatus (1) is provided with a pulse-wave laser light oscillator (10) that oscillates pulse-wave laser light (PW) and a continuous-wave laser light oscillator (11) that oscillates continuous-wave laser light (CW), wherein a first portion composed of a first material (M) of the workpiece (ZE) is cut by the pulse-wave laser light (PW), and a second portion which is composed of a second material (A) different from the first material (M) of the workpiece (ZE) is cut by the continuous-wave laser light (CW). |
