| 摘要 |
PURPOSE:To bond lead wires through which currents are made to flow to the channels of a laser array element readily, by providing a plurality of conductor parts which are extending in the perpendicular direction with respect to the emitting direction of laser beams from the laser array element so that the end parts thereof are exposed on the surface at the sides of the laser array element. CONSTITUTION:A laser array element 10 can oscillate a plurality of laser beams. The element 10 is die-bonded to a sub-mount 20 in a junctiondown pattern in this semiconductor laser device. The element is arranged on the sub-mount 20 in an insulated state. One end part of each of a plurality of conductor parts 30, 40 and 50 is connected to each electrode through which a current is conducted io the laser array element 10 for oscillating each laser beam. The other end part of each conductor part is extending in the direction perpendicular to the emitting direction of the laser beam from the laser array element 10. The other end parts are exposed on the surface at the sides of the laser array elements 10. For example, said conductor parts 30, 40 and 50 have Au conductor layers 31, 41 and 51 which are laminated on insulating layers 61, 62 and 63. |
