| 发明名称 |
METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE |
| 摘要 |
A method for manufacturing an electronic device including a substrate, including assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier, and disjoining the substrate relatively to the carrier. After the step of assembling, the method includes formation of a film on the substrate, the film being configured to adhere to an adhesion zone of a second face of the substrate opposite the first face of the substrate, the adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than the joining force between the joining zone of the carrier and the joining zone of the first face of the substrate. A traction on the film has a force of traction configured to overcome the joining force without overcoming the adhesive force. |
| 申请公布号 |
US2016375672(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201615192274 |
申请日期 |
2016.06.24 |
| 申请人 |
Commissariat A L'Energie Atomique et aux Energies Alternatives |
发明人 |
BEDJAOUI Messaoud;GARREC Pierre;NIZOU Sylvain |
| 分类号 |
B32B37/12;H01M6/02;G02F1/1333;H01G4/38;G02F1/153;H01M6/40;H01G4/30 |
主分类号 |
B32B37/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing an electronic device comprising a substrate, the method comprising:
assembling the substrate, by a joining zone of a first face of the substrate, with a joining zone of a first face of a carrier; disjoining the substrate relatively to the carrier; forming at least one electronic component from a second face of the substrate opposite the first face of the substrate at least partially after the step of assembling; forming a film on the substrate, said film being configured to adhere to an adhesion zone of the second face of the substrate, an adhesive force between the film and the adhesion zone of the second face of the substrate being chosen greater than a joining force between the joining zone of the carrier and the joining zone of the first face of the substrate, with the step of forming of at least one component being carried out before the forming of the film, with the forming of the film being carried out after the assembling and being configured to cover the at least one electronic component; after the forming of the film, operating a traction on the film with a force of traction configured to overcome the joining force, without overcoming the adhesive force. |
| 地址 |
Paris FR |
