发明名称 化合物半導体基板及びその製造方法
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method which can easily achieve a compound semiconductor substrate including on an Si substrate, GaAsSb which has good crystallinity and excellent surface flatness.SOLUTION: A manufacturing method of a present embodiment is a manufacturing method of compound semiconductor substrate in which a first compound semiconductor layer and a second compound semiconductor layer are alternately stacked on an Si substrate. A process of forming the second compound semiconductor layer is a process of simultaneously exposing a Ga material, an As material and an Sb material. A ratio of a molecular beam intensity of the Sb material to a molecular beam intensity of the Ga material, which is necessary for making a formation speed of the second compound semiconductor layer be 1 μm per one hour is not less than 1.
申请公布号 JP6050595(B2) 申请公布日期 2016.12.21
申请号 JP20120053445 申请日期 2012.03.09
申请人 旭化成株式会社 发明人 外賀 寛崇;諸原 理
分类号 H01L21/203;H01L33/30;H01S5/323 主分类号 H01L21/203
代理机构 代理人
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