Wiring board and semiconductor device

摘要

A wiring board includes a first wiring layer, a first insulating layer, first via wirings, connection terminals and a protection layer. The first insulating layer is formed with through holes. The first via wirings are formed in the through holes. The connection terminals are electrically connected to the first wiring layer through the first via wirings. The connection terminals protrude upward from the first insulating layer. The protection layer is made of insulating resin which contains photosensitive resin as a main component. The protection layer is formed on an upper surface of the first insulating layer. The protection layer includes first and second protection layers. The first protection layer surrounds the connection terminals. The second protection layer is separated from the first protection layer. The second protection layer is thinner than the first protection layer.

主权项

1. A wiring board comprising:
a first wiring layer comprising
an upper surface,a lower surface that is opposite from the upper surface, anda side surface that connects the upper surface and the lower surface; a first insulating layer made of first insulating resin which contains first photosensitive resin as a main component, the first insulating layer covering the side surface of the first wiring layer and covering one part of the upper surface of the first wiring layer, the first insulating layer being formed with through holes, the through holes passing through the first insulating layers in a thickness direction, the through holes exposing the remaining part of the first wiring layer; first via wirings formed in the through holes; connection terminals that are electrically connected to the first wiring layer through the first via wirings, that protrude upward from an upper surface of the first insulating layer, and that are to be connected to an electronic component; and a protection layer that is made of second insulating resin which contains second photosensitive resin as a main component and that is formed on the upper surface of the first insulating layer, wherein the protection layer comprises
a first protection layer that is formed in a mounting region in which the electronic component is to be mounted, and that surrounds the connection terminals, anda second protection layer that is formed in an outer peripheral region outside the mounting region, that is separated from the first protection layer by a first opening portion which exposes the upper surface of the first insulating layer, and that is thinner than the first protection layer.