摘要 |
This disclosure describes a double-sided transmission substrate (20) formed with striplines and end-ports in juxtaposition on either side. The transmission substrate (20) is sandwiched between two exterior dielectric substrates (21,22), each coated on one side with a metallic layer (24). The three substrates (20,21,22) are laminated together. Through-holes are drilled into the lamination and its interior substrate, at known locations to intersect the said ports. The copper exteriors (24) of each board (21,22) are etched to identify two contact pad lands (25) on each side. Plated-thru holes (27) are created to connect to each of the ports. <IMAGE> |